![[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bonding]()
[IEEE 2018 IEEE CPMT Symposium Japan (ICSJ) - Kyoto (2018.11.19-2018.11.21)] 2018 IEEE CPMT Symposium Japan (ICSJ) - Experimental investigations on the impact of bond process parameters in two-dimensional ultrasonic copper bondingDymel, Collin; Schemmel, Reinhard; Hemsel, Tobias; Sextro, Walter; Brokelmann, Michael; Hunstig, Matthias · 2018