Aluminium alloy as an interconnecting material in the fabrication of integrated circuits : Tapan Kumar Gupta. Microelectron. Reliab.19, 337 (1979)

• 卷第20卷
• 期第6期
• 印刷ISSN0026-2714
• 文件大小134.36KB
• 发表时间1980
• DOI10.1016/0026-2714(80)90131-6