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Effects of Cu and Si Dopants on Electromigration Mass Transport in Al Interconnects for VLSILee, C. H.; Fejes, P. L.; York, B. R.; Elwell, S. A.; Carnes, R. O.; Lee, J. Y.; Grivna, G. M.; Bauguess, S. W.; Dreyer, M. L.; Edwards, S. R. · MRS Proceedings · 1995