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[IEEE 21st International Reliability Physics Symposium - Phoenix, AZ, USA (1983.04.5-1983.04.7)] 21st International Reliability Physics Symposium - The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers

[IEEE 21st International Reliability Physics Symposium - Phoenix, AZ, USA (1983.04.5-1983.04.7)] 21st International Reliability Physics Symposium - The Effects of Entrapped Bubbles in Solder Used for the Attachment of Leadless Ceramic Chip Carriers

DerMarderosian, Aaron; Gionet, Vincent

作者DerMarderosian, Aaron; Gionet, Vincent
文件大小7146.61KB
发表时间1983
DOI10.1109/irps.1983.361989
页码235-241

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