On the stress measurement method using grain growth process of electrodeposited copper foil. (1st report Grain nucleation and grain growth)
KITAOKA, Seiichiro; KOBAYASHI, Toshihiro; OHSHIMA, Kazuhiko; MIKURIYA, Teruaki
- 期刊名称Transactions of the Japan Society of Mechanical Engineers Series A
- 作者KITAOKA, Seiichiro; KOBAYASHI, Toshihiro; OHSHIMA, Kazuhiko; MIKURIYA, Teruaki
- 卷第53卷
- 期第487期
- 印刷ISSN0387-5008
- 电子ISSN1884-8338
- 文件大小965.11KB
- 发表时间1987
- DOI10.1299/kikaia.53.646
- 页码646-652