发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 38th Electronics Components Conference 1988., Proceedings. - Los Angeles, CA, USA (9-11 May 1988)] 38th Electronics Components Conference 1988., Proceedings. - Ultra-reliable packaging for silicon-on-silicon WSI

[IEEE 38th Electronics Components Conference 1988., Proceedings. - Los Angeles, CA, USA (9-11 May 1988)] 38th Electronics Components Conference 1988., Proceedings. - Ultra-reliable packaging for silicon-on-silicon WSI

Hagge, J.K.

作者Hagge, J.K.
文件大小1024.37KB
发表时间1988
DOI10.1109/ecc.1988.12606
页码282-292

← 返回【学霸图书馆】主页