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[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - The deposition and planarization of a conformal, 300 degrees C APCVD interlevel dielectric

[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - The deposition and planarization of a conformal, 300 degrees C APCVD interlevel dielectric

White, L.K.; Shaw, J.M.; Kurylo, W.A.; Miszkowski, N.A.
  • 作者White, L.K.; Shaw, J.M.; Kurylo, W.A.; Miszkowski, N.A.
  • 文件大小421.83KB
  • 发表时间1988
  • DOI10.1109/vmic.1988.14218
  • 页码397-403
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