[IEEE 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - Santa Clara, CA, USA (13-14 June 1988)] 1988. Proceedings., Fifth International IEEE VLSI Multilevel Interconnection Conference - The deposition and planarization of a conformal, 300 degrees C APCVD interlevel dielectric
White, L.K.; Shaw, J.M.; Kurylo, W.A.; Miszkowski, N.A.
- 作者White, L.K.; Shaw, J.M.; Kurylo, W.A.; Miszkowski, N.A.
- 文件大小421.83KB
- 发表时间1988
- DOI10.1109/vmic.1988.14218
- 页码397-403