Residual thermal tempering stresses
- 期刊名称Computers & Structures
- 作者P. Chabrand; C. Licht; O. Maisonneuve; M. Raous
- 卷第31卷
- 期第6期
- 印刷ISSN0045-7949
- 文件大小865.09KB
- 发表时间1989
- DOI10.1016/0045-7949(89)90285-x
- 页码1003-1011
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