发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE IEEE National Aerospace and Electronics Conference - Dayton, OH, USA (22-26 May 1989)] Proceedings of the IEEE National Aerospace and Electronics Conference - Mechanical considerations for reliable interfaces in next generation electronics packaging

[IEEE IEEE National Aerospace and Electronics Conference - Dayton, OH, USA (22-26 May 1989)] Proceedings of the IEEE National Aerospace and Electronics Conference - Mechanical considerations for reliable interfaces in next generation electronics packaging

Hagge, J.K.

作者Hagge, J.K.
文件大小415.34KB
发表时间1989
DOI10.1109/naecon.1989.40498
页码2021-2026

← 返回【学霸图书馆】主页