发现好书期刊,享受阅读乐趣

海量图书期刊资源,随时随地畅享阅读乐趣

Measurement of copper plating thickness on ceramics by eddy current thickness tester.

Measurement of copper plating thickness on ceramics by eddy current thickness tester.

NISHIGAWA, Tadahiro
  • 期刊名称Journal of the Surface Finishing Society of Japan
  • 作者NISHIGAWA, Tadahiro
  • 卷第40卷
  • 期第2期
  • 印刷ISSN0915-1869
  • 电子ISSN1884-3409
  • 文件大小1614.26KB
  • 发表时间1989
  • DOI10.4139/sfj.40.268
  • 页码268-271
← 返回【学霸图书馆】主页