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SPIE Proceedings [SPIE Fibers '91, Boston, MA - Boston, MA (Tuesday 3 September 1991)] Microelectronic Interconnects and Packages: Optical and Electrical Technologies - <title>Three-dimensional capacitance modeling of advanced multilayer interconnection technologies</title>

SPIE Proceedings [SPIE Fibers '91, Boston, MA - Boston, MA (Tuesday 3 September 1991)] Microelectronic Interconnects and Packages: Optical and Electrical Technologies - Three-dimensional capacitance modeling of advanced multilayer interconnection technologies

Edelstein, Daniel C.; Arjavalingam, Gnanalingam; Pazaris, James

作者Edelstein, Daniel C.; Arjavalingam, Gnanalingam; Pazaris, James
卷第1389卷
印刷ISSN0277-786X
文件大小593.86KB
发表时间1991
DOI10.1117/12.25537
页码352-360

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