Materials issues in the multichip module packaging of electronics
- 作者D. B. Knorr; D. R. Frear; W. L. Winterbottom
- 卷第44卷
- 期第7期
- 印刷ISSN1047-4838
- 电子ISSN1543-1851
- 文件大小356.31KB
- 发表时间1992-07
- DOI10.1007/bf03222267
- 页码7-7
同作者推荐
The thermophysical properties of molten materialsTony Overfelt; Thomas Glasgow · 1993
Space: A unique environment for process modeling R&DTony Overfelt · 1991
A note on the sensitivity of solidification models to thermophysical propertiesTony Overfelt · 1994
Solar furnace satellite for large diameter crystal growth in spaceOVERFELT, TONY; WELLS, MARK; BLAKE, JOHN · Journal of Spacecraft and Rockets · 1993
[ASCE AIP Conference Proceedings Volume 387 - Albuquerque, New Mexico (USA) (26-30 Jan 1997)] Space technology and applications international forum (STAIF - 97) - Programmatic and economic challenges for commercial space processingOverfelt, Tony; Watkins, John · 1997