[IEEE Summer Topical Meeting Digest on Broadband Analog and Digital Optoelectronics, Optical Multiple Access Networks, Integrated Optoelectronics, Smart Pixels - Santa Barbara, CA, USA (29 July-12 Aug. 1992)] Summer Topical Meeting Digest on Broadband Analog and Digital Optoelectronics, Optical Multiple Access Networks, Integrated Optoelectronics, Smart Pixels - A Silicon Waferboard Approach To Optoelectronic Packaging
Tabasky, M.; Fitzgerald, T.; Bulat, E.; Silletti, A.; Melman, P.; Foley, B.; Boudreau, R.; Armiento, C.; Haugsjaa, P.O.
- 作者Tabasky, M.; Fitzgerald, T.; Bulat, E.; Silletti, A.; Melman, P.; Foley, B.; Boudreau, R.; Armiento, C.; Haugsjaa, P.O.
- 文件大小110.37KB
- 发表时间1992
- DOI10.1109/leosst.1992.697471