Study of Electrical Properties of Defects in Soi Films by Wafer Bonding
- 期刊名称MRS Proceedings
- 作者Usami, Akira; Natori, Taichi; Ito, Akira; Ishigami, Shun-ichiro; Tokuda, Yutaka; Wada, Takao
- 卷第262卷
- 电子ISSN1946-4274
- 文件大小303.36KB
- 发表时间1992-1
- DOI10.1557/proc-262-349