Three-dimensional finite-element investigation of current crowding and peak temperatures in VLSI multilevel interconnections

• 作者Trattles, J.T.; O'Neill, A.G.; Mecrow, B.C.
• 卷第40卷
• 期第7期
• 印刷ISSN0018-9383
• 电子ISSN1557-9646
• 文件大小409.76KB
• 发表时间1993
• DOI10.1109/16.216444
• 页码1344-1347