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Low-Temperature Copper Ordering in the Layered Thiophosphate CuVP2S6: A Time-of-Flight Neutron Powder Diffraction Study

Low-Temperature Copper Ordering in the Layered Thiophosphate CuVP2S6: A Time-of-Flight Neutron Powder Diffraction Study

G. Burr; E. Durand; M. Evain; R. Brec
  • 作者G. Burr; E. Durand; M. Evain; R. Brec
  • 卷第103卷
  • 期第2期
  • 印刷ISSN0022-4596
  • 电子ISSN1095-726X
  • 文件大小168.49KB
  • 发表时间1993
  • DOI10.1006/jssc.1993.1129
  • 页码514-518
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