Reactive Interdiffusion
- 期刊名称Materials Science Forum
- 作者Philibert, Jean
- 电子ISSN1662-9752
- 文件大小754.69KB
- 发表时间1994
- DOI10.4028/www.scientific.net/MSF.155-156.15
- 页码15-30
[IEEE 2011 International Conference on Devices and Communications (ICDeCom) - Mesra, Ranchi, India (2011.02.24-2011.02.25)] 2011 International Conference on Devices and Communications (ICDeCom) - ICDECOM 2011 Copyright Page2011
[IEEE 2011 International Conference on Devices and Communications (ICDeCom) - Mesra, Ranchi, India (2011.02.24-2011.02.25)] 2011 International Conference on Devices and Communications (ICDeCom) - ICDECOM 2011 Title Page2011
[IEEE 2011 International Conference on Applied Superconductivity and Electromagnetic Devices (ASEMD) - Sydney, Australia (2011.12.14-2011.12.16)] 2011 International Conference on Applied Superconductivity and Electromagnetic Devices -Jian Bin Zeng, ; Guo, You Guang; Zhu, Jian Guo; Lin, Zhi Wei · 2011
[IEEE 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA) - Kuala Lumpur, Malaysia (2011.04.25-2011.04.27)] 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA) - Contents2011
[IEEE 2011 International Conference on Simulation of Semiconductor Processes and Devices (SISPAD 2011) - Osaka (2011.9.8-2011.9.10)] 2011 International Conference on Simulation of Semiconductor Processes and Devices - [Front and back cover]2011
[IEEE 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA) - Kuala Lumpur, Malaysia (2011.04.25-2011.04.27)] 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA) - Copyright page2011
[IEEE 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA) - Kuala Lumpur, Malaysia (2011.04.25-2011.04.27)] 2011 International Conference on Electronic Devices, Systems and Applications (ICEDSA) - Organization committee2011