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In-situ stress investigations on thin copper films with the STM

In-situ stress investigations on thin copper films with the STM

Dr. Thomas Fries; Dr. Klaus Oster; Dr. Klaus Wandelt

作者Dr. Thomas Fries; Dr. Klaus Oster; Dr. Klaus Wandelt
卷第6卷
期第6期
印刷ISSN0935-9648
电子ISSN1521-4095
文件大小466.99KB
发表时间1994
DOI10.1002/adma.19940060606
页码473-476

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