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Flip chip on board connection technology: process characterization and reliability

Flip chip on board connection technology: process characterization and reliability

Giesler, J.; O'Malley, G.; Williams, M.; Machuga, S.

期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
作者Giesler, J.; O'Malley, G.; Williams, M.; Machuga, S.
卷第17卷
期第3期
印刷ISSN1070-9894
文件大小776.74KB
发表时间1994
DOI10.1109/96.311771
页码256-263

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