Thermal analysis of IC packages and printed circuit boards
- 期刊名称Journal of Electronics Manufacturing
- 作者TAY, A.A.O.
- 卷第4卷
- 期第4期
- 印刷ISSN0960-3131
- 文件大小879.55KB
- 发表时间1994-12
- DOI10.1142/S0960313194000249
- 页码223-230
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