Interface Structure and Adhesion of Ti Films on Si Substrates.
KONDO, Ichiharu; KONDO, Kenji; TAKENAKA, Osamu; KINBARA, Akira
- 期刊名称Journal of the Surface Finishing Society of Japan
- 作者KONDO, Ichiharu; KONDO, Kenji; TAKENAKA, Osamu; KINBARA, Akira
- 卷第45卷
- 期第7期
- 印刷ISSN0915-1869
- 电子ISSN1884-3409
- 文件大小1125.77KB
- 发表时间1994
- DOI10.4139/sfj.45.695
- 页码695-699