Chemical additives for improved copper chemical vapour deposition processing

• 作者John A.T. Norman; David A. Roberts; Arthur K. Hochberg; Paul Smith; Gary A. Petersen; John E. Parmeter; Chris A. Apblett; Thomas R. Omstead
• 卷第262卷
• 印刷ISSN0040-6090
• 文件大小697.00KB
• 发表时间1995
• DOI10.1016/0040-6090(94)05808-3
• 页码46-51