[IEEE 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Singapore (27 Nov.-1 Dec. 1995)] Proceedings of 5th International Symposium on the Physical and Failure Analysis of Integrated Circuits - Oxidation of copper leadframe
- 作者Ang, G.L.; Goh, L.C.; Heng, K.W.; Lahiri, S.K.
- 文件大小246.83KB
- 发表时间1995
- DOI10.1109/ipfa.1995.487626
- 页码218-220
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