Fine line thin dielectric circuit board characterization

• 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
• 作者Chi Shih Chang, ; Agrawal, A.P.
• 卷第18卷
• 期第4期
• 印刷ISSN1070-9886
• 文件大小1013.49KB
• 发表时间1995
• DOI10.1109/95.477472
• 页码842-850