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[IEEE 4th International Conference on Solid-State and IC Technology - Beijing, China (24-28 Oct. 1995)] Proceedings of 4th International Conference on Solid-State and IC Technology - A modified model of high-T/sub c/ superconducting interconnect propagation characteristics for VLSI packaging

[IEEE 4th International Conference on Solid-State and IC Technology - Beijing, China (24-28 Oct. 1995)] Proceedings of 4th International Conference on Solid-State and IC Technology - A modified model of high-T/sub c/ superconducting interconnect propagation characteristics for VLSI packaging

Jinfeng Kang, ; Ruqi Han, ; Yangyuan Wang,

作者Jinfeng Kang, ; Ruqi Han, ; Yangyuan Wang,
文件大小167.40KB
发表时间1995
DOI10.1109/icsict.1995.503351
页码562-564

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