[IEEE 1996 46th Electronic Components and Technology Conference - Orlando, FL, USA (28-31 May 1996)] 1996 Proceedings 46th Electronic Components and Technology Conference - The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603/sup TM/ and PowerPC 604/sup TM/ RISC microprocessors

• 作者Parry, J.; Rosten, H.; Kromann, G.B.
• 文件大小1333.19KB
• 发表时间1996
• DOI10.1109/ectc.1996.517392
• 页码195-204