[IEEE Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium 1997 IEMT Symposium - Austin, TX, USA (13-15 Oct. 1997)] Twenty First IEEE/CPMT International Electronics Manufacturing Technology Symposium Proceedings 1997 IEMT Symposium - A parametric study of flip chip reliability based on solder fatigue modelling
- 作者Popelar, S.F.
- 文件大小890.03KB
- 发表时间1997
- DOI10.1109/iemt.1997.626935
- 页码299-307
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