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[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Processing and reliability of flip-chip on board connections

[IEEE 1997 1st Electronic Packaging Technology Conference - Singapore (8-10 Oct. 1997)] Proceedings of the 1997 1st Electronic Packaging Technology Conference (Cat. No.97TH8307) - Processing and reliability of flip-chip on board connections

Collier, P.A.; Teo, K.H.

作者Collier, P.A.; Teo, K.H.
文件大小1208.71KB
发表时间1997
DOI10.1109/eptc.1997.723918
页码251-258

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