Multiconductor transmission line characterization
- 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- 作者Williams, D.F.
- 卷第20卷
- 期第2期
- 印刷ISSN1070-9894
- 文件大小146.01KB
- 发表时间1997-5
- DOI10.1109/96.575563
- 页码129-132
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