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Electrical conduction through compound semiconductor wafer bonded interfaces

Electrical conduction through compound semiconductor wafer bonded interfaces

D.A. Vanderwater; F.A. Kish; M.J. Peansky; S.J. Rosner

作者D.A. Vanderwater; F.A. Kish; M.J. Peansky; S.J. Rosner
卷第174卷
印刷ISSN0022-0248
文件大小531.15KB
发表时间1997
DOI10.1016/s0022-0248(96)01107-4
页码213-219

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