Plastic Encapsulated Microelectronics; Materials, Processes, Quality, Reliability, and Application

• 期刊名称Journal of Electronic Packaging
• 作者Pecht, Michael G.; Nguyen, Luu T.; Hakim, Edward B.; Rafanelli, Anthony J.
• 卷第119卷
• 期第2期
• 印刷ISSN1043-7398
• 文件大小298.72KB
• 发表时间1997
• DOI10.1115/1.2792221