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Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Quality Conformance and Qualification of Microelectronic Packages and Interconnects

Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y.; Rafanelli, Anthony J.
  • 期刊名称Journal of Electronic Packaging
  • 作者Pecht, Michael; Dasgupta, Abhijit; Evans, John W.; Evans, Jillian Y.; Rafanelli, Anthony J.
  • 卷第119卷
  • 期第1期
  • 印刷ISSN1043-7398
  • 文件大小106.90KB
  • 发表时间1997
  • DOI10.1115/1.2792205
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