The development of component-level thermal compact models of a C4/CBGA interconnect technology: the Motorola PowerPC 603 and PowerPC 604 RISC microprocessors
- 期刊名称IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
- 作者Parry, J.; Rosten, H.; Kromann, G.B.
- 卷第21卷
- 期第1期
- 印刷ISSN1070-9886
- 文件大小273.88KB
- 发表时间1998-3
- DOI10.1109/95.679039
- 页码104-112
[IEEE 2008 International Conference on Risk Management & Engineering Management - Beijing (2008.11.4-2008.11.6)] 2008 International Conference on Risk Management & Engineering Management - [Cover art]2008
[IEEE 2008 International Conference on Risk Management & Engineering Management - Beijing, China (2008.11.4-2008.11.6)] 2008 International Conference on Risk Management & Engineering Management - Preface2008
[IEEE 2008 IEEE International Conference on Industrial Engineering and Engineering Management - Singapore, Singapore (2008.12.8-2008.12.11)] 2008 IEEE International Conference on Industrial Engineering and Engineering Management - Copyright2008
[IEEE 2008 IEEE International Conference on Industrial Engineering and Engineering Management - Singapore, Singapore (2008.12.8-2008.12.11)] 2008 IEEE International Conference on Industrial Engineering and Engineering Management - Cover2008
[IEEE 2008 International Conference on Risk Management & Engineering Management - Beijing, China (2008.11.4-2008.11.6)] 2008 International Conference on Risk Management & Engineering Management - Organizing Committee2008
[IEEE 2008 International Conference on Risk Management & Engineering Management - Beijing, China (2008.11.4-2008.11.6)] 2008 International Conference on Risk Management & Engineering Management - Roster page2008
[IEEE 2008 International Conference on Risk Management & Engineering Management - Beijing, China (2008.11.4-2008.11.6)] 2008 International Conference on Risk Management & Engineering Management - Author Index2008
[IEEE 2008 IEEE International Conference on Industrial Engineering and Engineering Management (IEEM) - Singapore, Singapore (2008.12.8-2008.12.11)] 2008 IEEE International Conference on Industrial Engineering and Engineering Management -Puha, S.; Makinen, S.J. · 2008