[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Reliability assessment of flip chip on board connections
- 作者Teo, K.H.
- 文件大小646.40KB
- 发表时间1998
- DOI10.1109/eptc.1998.756014
- 页码269-273
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