发现好书期刊，享受阅读乐趣

海量图书期刊资源，随时随地畅享阅读乐趣

[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Reliability assessment of transfer molded CSP

[IEEE 2nd Electronics Packaging Technology Conference - Singapore (8-10 Dec. 1998)] Proceedings of 2nd Electronics Packaging Technology Conference (Cat. No.98EX235) - Reliability assessment of transfer molded CSP

Lee, T.K.; Teo, Y.C.; Lim, T.B.

作者Lee, T.K.; Teo, Y.C.; Lim, T.B.
文件大小503.45KB
发表时间1998
DOI10.1109/EPTC.1998.756015
页码274-278

← 返回【学霸图书馆】主页