[IEEE 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998. Presented at Adhesives '98 - Binghamton, NY, USA (28-30 Sept. 1998)] Proceedings of 3rd International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing 1998 (Cat. No.98EX180) - A reliable and environmentally friendly packaging technology-flip chip joining using anisotropically conductive adhesive
- 作者Tolvgard, A.; Malmodin, J.; Liu, J.; Lai, Z.
- 文件大小1287.06KB
- 发表时间1998
- DOI10.1109/adhes.1998.741997
- 页码19-26
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