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[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

[IEEE 1998 International Conference on Multichip Modules and High Density Packaging - Denver, CO, USA (15-17 April 1998)] Proceedings. 1998 International Conference on Multichip Modules and High Density Packaging (Cat. No.98EX154) - Hermetic-equivalent packaging of data accumulator MCM-L modules for general aviation avionics applications

Conway, C.M.; Hagge, J.K.

作者Conway, C.M.; Hagge, J.K.
文件大小750.07KB
发表时间1998
DOI10.1109/icmcm.1998.670817
页码416-421

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