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[IEEE Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting - St. Louis, MO, USA (12-15 Oct. 1998)] Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) - The thermal impedance of new power semiconductor modules using AlN substrates

[IEEE Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting - St. Louis, MO, USA (12-15 Oct. 1998)] Conference Record of 1998 IEEE Industry Applications Conference. Thirty-Third IAS Annual Meeting (Cat. No.98CH36242) - The thermal impedance of new power semiconductor modules using AlN substrates

Mitic, G.; Sommer, K.-H.; Dieci, D.; Lefranc, G.
  • 作者Mitic, G.; Sommer, K.-H.; Dieci, D.; Lefranc, G.
  • 卷第2卷
  • 文件大小582.38KB
  • 发表时间1998
  • DOI10.1109/ias.1998.730272
  • 页码1026-1030
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