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Fabrication technology for high-density Josephson integrated circuits using mechanical polishing planarization

Fabrication technology for high-density Josephson integrated circuits using mechanical polishing planarization

Numata, H.; Nagasawa, S.; Tanaka, M.; Tahara, S.

期刊名称IEEE Transactions on Appiled Superconductivity
作者Numata, H.; Nagasawa, S.; Tanaka, M.; Tahara, S.
卷第9卷
期第2期
印刷ISSN1051-8223
文件大小461.57KB
发表时间1999-6
DOI10.1109/77.783709
页码3198-3201

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