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Insulation performance of pressurized liquid helium under quench-induced thermal bubble disturbance for superconducting power apparatus

Insulation performance of pressurized liquid helium under quench-induced thermal bubble disturbance for superconducting power apparatus

Chigusa, S.; Maeda, H.; Taniguchi, Y.; Hayakawa, N.; Okubo, H.
  • 期刊名称IEEE Transactions on Dielectrics and Electrical Insulation
  • 作者Chigusa, S.; Maeda, H.; Taniguchi, Y.; Hayakawa, N.; Okubo, H.
  • 卷第6卷
  • 期第3期
  • 印刷ISSN1070-9878
  • 文件大小1140.10KB
  • 发表时间1999-6
  • DOI10.1109/94.775627
  • 页码385-392
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