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[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Flip chip package design optimization

[IEEE 1999 Proceedings. 49th Electronic Components and Technology Conference - San Diego, CA, USA (1-4 June 1999)] 1999 Proceedings. 49th Electronic Components and Technology Conference (Cat. No.99CH36299) - Flip chip package design optimization

Shenoy, J.N.; Dandia, S.

作者Shenoy, J.N.; Dandia, S.
文件大小458.43KB
发表时间1999
DOI10.1109/ectc.1999.776177
页码232-237

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