![[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Rapid formation of Cu-Sn intermetallic compounds by strong electric current]()
[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Rapid formation of Cu-Sn intermetallic compounds by strong electric currentLiu, Baolei; Tian, Yanhong; Wang, Shang; Zhang, Rui; Zhao, Xin; Dong, Chenglong; Wang, Chunqing · 2014