Cure and glass transition temperature of the bisphenol S epoxy resin with 4,4′-diaminodiphenylmethane

• 作者Jungang Gao; Yanfang Li; Min Zhao; Guodong Liu
• 卷第78卷
• 期第4期
• 印刷ISSN0021-8995
• 电子ISSN1097-4628
• 文件大小128.57KB
• 发表时间2000
• DOI10.1002/1097-4628(20001024)78:4<794::aid-app120>3.0.co;2-h
• 页码794-799