Laplace transforms and American options
- 期刊名称Applied Mathematical Finance
- 作者Mallier, Roland; Alobaidi, Ghada
- 卷第7卷
- 期第4期
- 印刷ISSN1350-486X
- 电子ISSN1466-4313
- 文件大小494.31KB
- 发表时间2000-12
- DOI10.1080/13504860110060384
- 页码241-256
Thermal Characterization of Copper Microchannel Heat Sink for Power Electronics CoolingSingh, Randeep; Akbarzadeh, Aliakbar; Mochizuki, Masataka; Nguyen, Thang; Nguyen, Tien · Journal of Thermophysics and Heat Transfer · 2009
An Emergency Core Cooling System (ECCS) for Nuclear Power Reactor Using Passive Loop Heat PipeMochizuki, Masataka; Singh, Randeep; Nguyen, Thang; Saito, Yuji; Nguyen, Tien · Journal of The Japan Institute of Electronics Packaging · 2012
[ASME 2010 14th International Heat Transfer Conference - Washington, DC, USA (August 8–13, 2010)] 2010 14th International Heat Transfer Conference, Volume 3 - Data Center Energy Conservation by Heat Pipe Cold Energy Storage SystemWu, Xiao Ping; Mochizuki, Masataka; Mashiko, Koichi; Nguyen, Thang; Nguyen, Tien; Wuttijumnong, Vijit; Cabusao, Gerald; Singh, Randeep; Akbarzadeh, Aliakbar · 2010
[IEEE 2012 IEEE/CPMT 28th Semiconductor Thermal Measurement & Management Symposium (SEMI-THERM) - San Jose, CA, USA (2012.03.18-2012.03.22)] 2012 28th Annual IEEE Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM) - High-performance nickel wick development for loop heat pipesWuttijumnong, Vijit; Singh, Randeep; Mochizuki, Masataka; Goto, Kazuhiko; Thang Nguyen, ; Tien Nguyen, ; Mashiko, Koichi · 2012
[ASME ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer - Tainan, Taiwan (June 6–9, 2008)] ASME 2008 First International Conference on Micro/Nanoscale Heat Transfer, Parts A and B - Development of Miniature Loop Heat Pipes for the Thermal Control of LaptopsMochizuki, Masataka; Saito, Yuji; Nguyen, Thang; Nguyen, Tien; Wuttijumnong, Vijit; Horiuchi, Yasuhiro; Tacomkang, Roj; Singh, Randeep; Akbarzadeh, Aliakbar · 2008
[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2 - Contribution of Heat Pipe to the Energy Conservation of Data Center and Cloud ComputersMochizuki, Masataka; Nguyen, Thang; Mashiko, Koichi; Saito, Yuji; Wu, Xiao Ping; Nguyen, Tien; Wuttijumnong, Vijit; Singh, Randeep · 2011
Metal Foams: Fundamentals and ApplicationsReay, David · Applied Thermal Engineering · 2013
Adsorption heat powered heat pumpsMeunier, Francis · Applied Thermal Engineering · 2013
Waste heat usageSwithenbank, Jim; Finney, Karen N.; Chen, Qun; Yang, Yao Bin; Nolan, Andy; Sharifi, Vida N. · Applied Thermal Engineering · 2013
Letter to the EditorSayin, Cenk; Gumus, Metin; Canakci, Mustafa · Applied Thermal Engineering · 2014
Review of alternative cooling technologiesSteven Brown, J.; Domanski, Piotr A. · Applied Thermal Engineering · 2014
Performance evaluation of ventilation radiatorsMyhren, Jonn Are; Holmberg, Sture · Applied Thermal Engineering · 2013
Publisher NoteApplied Thermal Engineering · 2013
Measuring fire size in tunnelsGuo, Xiaoping; Zhang, Qihui · Applied Thermal Engineering · 2013