Molecular dynamics simulation of microcrack healing in copper
- 作者S. Li; K.W. Gao; L.J. Qiao; F.X. Zhou; W.Y. Chu
- 卷第20卷
- 期第2期
- 印刷ISSN0927-0256
- 文件大小1114.09KB
- 发表时间2001
- DOI10.1016/s0927-0256(00)00130-0
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