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[Japan Soc. Appl. Phys 2001 Symposium on VLSI Technology. Digest of Technical Papers - Kyoto, Japan (12-14 June 2001)] 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184) - Barrier-metal-free (BMF), Cu dual-damascene interconnects with Cu-epi-contacts buried in anti-diffusive, low-k organic film

[Japan Soc. Appl. Phys 2001 Symposium on VLSI Technology. Digest of Technical Papers - Kyoto, Japan (12-14 June 2001)] 2001 Symposium on VLSI Technology. Digest of Technical Papers (IEEE Cat. No.01 CH37184) - Barrier-metal-free (BMF), Cu dual-damascene interconnects with Cu-epi-contacts buried in anti-diffusive, low-k organic film

Tada, M.; Ohtake, H.; Harada, Y.; Hiroi, M.; Saito, S.; Onodera, T.; Furutake, N.; Kawahara, J.; Tagami, M.; Kinoshita, K.; Fukai, T.; Mogami, T.; Hayashi, Y.

作者Tada, M.; Ohtake, H.; Harada, Y.; Hiroi, M.; Saito, S.; Onodera, T.; Furutake, N.; Kawahara, J.; Tagami, M.; Kinoshita, K.; Fukai, T.; Mogami, T.; Hayashi, Y.
文件大小415.49KB
发表时间2001
DOI10.1109/vlsit.2001.934923
页码13-14

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