[IEEE Proceedings of the IEEE 2001 International Interconnect Technology Conference - Burlingame, CA, USA (2001.06.6-2001.06.6)] Proceedings of the IEEE 2001 International Interconnect Technology Conference (Cat. No.01EX461) - Dual hard mask process for low-k porous organosilica dielectric in copper dual damascene interconnect fabrication
Hiroi, M.; Tada, M.; Ohtake, H.; Saito, S.; Onodera, T.; Furutake, N.; Harada, Y.; Hayashi, Y.
- 作者Hiroi, M.; Tada, M.; Ohtake, H.; Saito, S.; Onodera, T.; Furutake, N.; Harada, Y.; Hayashi, Y.
- 文件大小344.44KB
- 发表时间2001
- DOI10.1109/iitc.2001.930088
- 页码295-297