[IEEE 6th International Conference on Solid-State and IC Technology - Shanghai, China (22-25 Oct. 2001)] 2001 6th International Conference on Solid-State and Integrated Circuit Technology. Proceedings (Cat. No.01EX443) - Investigation of substrate damage and other issues in hydrogen plasma implantation for silicon-on-insulator (SOI) fabrication

• 作者Fu, R.K.Y.; Wang, L.W.; Chu, P.K.
• 卷第1卷
• 文件大小288.53KB
• 发表时间2001
• DOI10.1109/icsict.2001.981567
• 页码669-672