Electroless Nickel Ternary Alloy Deposition on SiO[sub 2] for Application to Diffusion Barrier Layer in Copper Interconnect Technology
- 期刊名称Journal of The Electrochemical Society
- 作者Osaka, Tetsuya; Takano, Nao; Kurokawa, Tetsuya; Kaneko, Tomomi; Ueno, Kazuyoshi
- 卷第149卷
- 期第11期
- 印刷ISSN0013-4651
- 文件大小882.72KB
- 发表时间2002
- DOI10.1149/1.1512669
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