Wafer bonding technique used for the integration of cubic GaN/GaAs (001) with Si substrate
Yuanping Sun; Fu Yi; Qu Bo; Wang Yutian; Feng Zhihong; Shen Xiaoming; Zhao Degang; Zheng Xinhe; Duan Lihong; Li Bingchen; Zhang Shuming; Yang Hui; Jiang Xiaoming; Zheng Wenli; Jia Quanjie
- 作者Yuanping Sun; Fu Yi; Qu Bo; Wang Yutian; Feng Zhihong; Shen Xiaoming; Zhao Degang; Zheng Xinhe; Duan Lihong; Li Bingchen; Zhang Shuming; Yang Hui; Jiang Xiaoming; Zheng Wenli; Jia Quanjie
- 卷第45卷
- 期第3期
- 文件大小721.85KB
- 发表时间2002-06
- DOI10.1360/02ye9030
- 页码255-260